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PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following documents to aid your design process.
Application Notes
? AN1955: Thermal Measurement Methodology of RF Power Amplifiers
? AN3100: General Purpose Amplifier Biasing
? AN3778: PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation
Software
? .s2p File
Development Tools
? Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the
Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
0
1
2
3
4
Date
Jan. 2008
Mar. 2008
Mar. 2008
May 2010
Jan. 2011
Description
? Initial Release of Data Sheet
? Corrected Table 7, Moisture Sensitivity Level Rating from 3 to 1, p. 3
? Corrected S--Parameter table frequency column label to read “MHz” versus “GHz”, p. 17, 18
? Corrected Tape and Reel information from 330 mm to 12 mm, p. 1
Corrected Figs. 24, 35, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power
?
y--axis (ACPR) unit of measure to dBc, p. 12, 16
? Added new Fig. 3, Third Order Output Intercept Point versus Output Power and Supply Current,
p. 4
? Added AN3778, PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat
Dissipation, Application Notes, p. 23
? Added .s2p File availability to Product Software, p. 23
? Corrected temperature at which ThetaJC is measured from 25 ° C to 89 ° C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
? Removed I DC bias callout from Table 10, Common Source S--Parameters heading as bias is not a
controlled value, p. 17--18
? Added Printed Circuit Boards availability to Development Tools, p. 23
MMG3006NT1
RF Device Data
Freescale Semiconductor
23
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